January
15
2015
Written by  Erika
Published in News and events

Hippocamp at Digimat Users Meeting 2014

From 21-23 October 2014, the Digimat Users Meeting was held in Rome. Universität Stuttgart was there presenting the Hippocamp Project, with the simulation of the damping properties of innovative HiPIMS (High Power Impulse Magnetron Sputtering) materials with Digimat. This multi-scale simulation tool has been tested to model the microstructure of such high-damping coating materials. A metal matrix composite made of carbon nitride with copper inclusions has been the first material to be investigated. The ultimate goal is to predict the influence of various material parameters of the composite on its damping potential in order to avoid the need of time-consuming and costly test runs. Digimat is regarded as a strong candidate for achieving this goal.

Damping is an increasingly important issue for many engineering applications such as machining, drilling, milling and other production processes involving cyclic loading and induced vibrations. Special coatings applied to mechanical structures or machine parts by plasma enhanced chemical vapor deposition (PECVD) are believed to be a potential key to diminish vibration-induced defects in the machined parts, especially those defects caused by self-excited vibrations called chatter.

The multi-scale simulation tool Digimat has been chosen to accurately model the microstructure of such high-damping coatings. A metal matrix composite made of carbon nitride with copper inclusions has been the first material to be investigated. The ultimate goal is to predict the influence of various material and microstructure parameters of the composite on its damping potential in order to avoid the need of time-consuming and costly test runs. The Digimat tool appears to be a strong candidate in achieving this goal.

Authors: Raphael Neuhaus, Gabriela Lorite, Qilin Fu, Masud-Ur- Rashid, Geza Toth, Zdenek Hubicka

Image Gallery

Download
Last modified on Friday, 17 June 2016 10:50
Login to post comments
Login to post comments