June
06
2016
Written by  Erika

Time-resolved ion flux and impedance measurements for process characterization in reactive high-power impulse magnetron sputtering

Scientific pubication by IONAUTICS and IP-ASCR on Time-resolved ion flux and impedance measurements for process characterization in reactive high-power impulse magnetron sputtering. More information: http://scitation.aip.org/content/avs/journal/jvsta/34/4/10.1116/1.4953033

ABSTRACT

 

A new planar ion flux probe, based on the Sobolewski method for time-resolved plasma characterization in inherently noisy pulsed plasma discharges, has been developed. The probe was evaluated in a high-power impulse magnetron sputtering (HiPIMS) process, which is a promising ionized physical vapordeposition technique based on pulsed plasma discharges used to engineer thin films with improved properties. Both nonreactive (pure Ar) and reactive (Ar/Odeposition processes were investigated using a Ti sputtering target. It was found that the process exhibited a nearly hysteresis-free and stable transition region at the chosen deposition conditions. Time-resolved measurements of the absolute ion flux impinging on the probe placed at the substrate position, as well as of the probe sheath impedance, were recorded in the metal, transition, and compound modes during the HiPIMS pulse. Gradual changes in themeasured ion flux, as well as the impedance, were seen when transiting from the metal mode to the compound (poisoned) mode. It is therefore suggested that this type of robust plasma probe can potentially be used for reactive process control, where the user would like to stably operate in the transition region over long periods of time.

 

Key Topics

 
Time-resolved ion flux and impedance measurements for process characterization in reactive high-power impulse magnetron sputtering
Last modified on Tuesday, 20 September 2016 11:49
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